Home
About Us
Represented Companies
» RF & Microwave
» Microelectronics,
Packaging & Electrooptics
» Ultracapacitors
» Avionics
Contact
 

Represented companies

Microelectronics, Packaging & Electrooptics

 

ES COMPONENTS

 

Bare Die Components, Chip Resistors,

Chip Capacitors, Obsolete Solutions

$20M Inventory

www.escomponents.com

 
 

GCS (Global Communication Semiconductors)

RFIC and Opto Technology Foundry
Services (InGaP, HBT, InP HBT, PHEMT,HFET, GaAs, SAW)

www.gcsincorp.com

 
 

LINEAR PHOTONICS 

Microwave Fiber Optic Links, Optic Receivers, Transmitters

www.linphotonics.com

 
 

RHE 

Custom Microsystems, Thick Film, Thin Film

www.rhe.de

 
 

SINCLAIR MANUFACTURING

RF, Hybrid Glass to Metal Seal Packages
Optical Windows

www.sinclairmfg.com

 
 

SENTEC

LTCC Multilayer Substrates Manufacturing

www.sentecee.com

 
 

WAVENICS, Inc.

Innovative MMIC and SIP Packaging Technology on Aluminum Substrates. New technology - Aluminum Platform (Smart AlŪ)

www.wavenics.com

 
 

 
 
© Liyam Electronics Ltd. | Email: sales@liyamel.com | Tel: +972 36413872 | Mob: +972 522312155 | Fax: +972 37447036
Liyam Electronics Home