Represented companies
Microelectronics, Packaging & Electrooptics
ES COMPONENTS
Bare Die Components, Chip Resistors,
Chip Capacitors, Obsolete Solutions
$20M Inventory |
www.escomponents.com |
| |
| |
GCS (Global Communication Semiconductors)
RFIC and Opto Technology Foundry
Services (InGaP, HBT, InP HBT, PHEMT,HFET, GaAs, SAW) |
www.gcsincorp.com |
| |
| |
LINEAR PHOTONICS
Microwave Fiber Optic Links, Optic Receivers, Transmitters |
www.linphotonics.com |
| |
| |
RHE
Custom Microsystems, Thick Film, Thin Film |
www.rhe.de |
| |
| |
SINCLAIR MANUFACTURING
RF, Hybrid Glass to Metal Seal Packages
Optical Windows |
www.sinclairmfg.com |
| |
| |
SENTEC
LTCC Multilayer Substrates Manufacturing |
www.sentecee.com |
| |
| |
WAVENICS, Inc.
Innovative MMIC and SIP Packaging Technology on Aluminum Substrates.
New technology - Aluminum Platform (Smart AlŪ)
|
www.wavenics.com |
| |
| |
|
